Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading
Thermal Plastic Condensor Fan Blade Fatigue of flip chip component solder joints is widely existing in thermal energy systems, which imposes a great challenge to operational safety.In order to investigate the influential factors, this paper develops a model to analyze thermal fatigue, based on the Darveaux energy method.Under cyclic thermal loading